Sockets for ICs, Transistors - Zhuoliou industry co.,ltd

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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
1-2324271-3 RIGHT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors	5,113	29.22	- + FFQ	Datasheet	Tray	-	Active	LGA 4189	2092	0.039 (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034 (0.86mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic
1-2324271-4 LEFT SEGMEN LGA4189-4 SOCKET-P4 TE Connectivity AMP Connectors	4,833	29.22	- + FFQ	Datasheet	Tray	-	Active	LGA 4189	2092	0.039 (1.00mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034 (0.86mm)	Gold	15.0µin (0.38µm)	Copper Alloy	Thermoplastic
2-2129710-5 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	654	35.76	- + FFQ	Datasheet	Tray	-	Active	LGA	3647	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Thermoplastic
2-2129710-6 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	1,188	35.88	- + FFQ	Datasheet	Tray	-	Active	LGA	3647	-	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	-	-	-	Copper Alloy	Thermoplastic
1-2199298-1 CONN IC DIP SOCKET 6POS TIN TE Connectivity AMP Connectors	20,188	0.26	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
1-2199298-2 CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors	8,365	0.28	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
1-2199298-3 CONN IC DIP SOCKET 14POS TIN TE Connectivity AMP Connectors	2,379	0.28	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
1-2199298-4 CONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors	4,836	0.32	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
1-2199298-5 CONN IC DIP SOCKET 18POS TIN TE Connectivity AMP Connectors	4,654	0.39	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
1-2199298-6 CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors	6,422	0.59	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
1-2199298-8 CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors	7,343	0.78	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
1-2199298-9 CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	7,232	0.88	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
1-2199299-2 28P,DIP SKT,600 CL,LDR,PB FREE TE Connectivity AMP Connectors	7,003	0.88	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Nickel	Polybutylene Terephthalate (PBT), Glass Filled
1-2199300-2 CONN IC DIP SOCKET 32POS TINLEAD TE Connectivity AMP Connectors	8,291	0.99	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.6 (15.24mm) Row Spacing	32 (2 x 16)	0.100 (2.54mm)	Tin-Lead	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame, No Center Bar	Solder	0.100 (2.54mm)	Tin-Lead	60.0µin (1.52µm)	Brass, Copper	Polyester
1-2199299-5 40P,DIP SKT,600 CL,LDR,PB FREE TE Connectivity AMP Connectors	7,006	1.18	- + FFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Nickel	Polybutylene Terephthalate (PBT), Glass Filled
808-AG11D-ES CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	1,527	1.19	- + FFQ	Datasheet	Tube	800	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	-	Polyester
1-1814655-1 CONN SOCKET SIP 16POS GOLD TE Connectivity AMP Connectors	4,371	2.12	- + FFQ	Datasheet	Bulk	-	Active	SIP	16 (1 x 16)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Thermoplastic, Polyester
2-2822979-3 CONN SOCKET LGA 3647POS GOLD TE Connectivity AMP Connectors	147	65.72	- + FFQ	Datasheet	Tray	-	Active	LGA	3647	0.039 (1.00mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.034 (0.86mm)	Gold	30.0µin (0.76µm)	Copper Alloy	Thermoplastic
8080-1G1 CONN TRANSIST TO-3 4POS GOLD TE Connectivity AMP Connectors	220	15.32	- + FFQ	Datasheet	Bulk	8080	Active	Transistor, TO-3	4 (Round)	-	Tin-Lead	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Tin-Lead	-	Beryllium Copper	Fluoropolymer (FP)
8080-1G15 CONN TRANSIST TO-3 3POS TIN-LEAD TE Connectivity AMP Connectors	2,589	16.28	- + FFQ	Datasheet	Bulk	8080	Active	Transistor, TO-3	3 (Oval)	-	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Fluoropolymer (FP)