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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
11-32AF-NI-16

11-32AF-NI-16

0.11 X 0.32 NI 16--11-32AF-NI-16

Leader Tech Inc.

3,213 20.52
- +

RFQ

11-32AF-NI-16

Datasheet

Bulk - Active Fingerstock - 0.320 (8.13mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper Nickel Flash Adhesive
11-32AH-NI-16

11-32AH-NI-16

0.11 X 0.32 NI 16--11-32AH-NI-16

Leader Tech Inc.

2,597 20.52
- +

RFQ

11-32AH-NI-16

Datasheet

Bulk - Active Fingerstock - 0.320 (8.13mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper Nickel Flash Adhesive
11-32AH-SN-16

11-32AH-SN-16

0.11 X 0.32 SN 16--11-32AH-SN-16

Leader Tech Inc.

3,345 20.52
- +

RFQ

11-32AH-SN-16

Datasheet

Bulk - Active Fingerstock - 0.320 (8.13mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper Tin Flash Adhesive
11-32RH-NI-16

11-32RH-NI-16

0.11 X 0.32 NI 16--11-32RH-NI-16

Leader Tech Inc.

2,936 20.52
- +

RFQ

11-32RH-NI-16

Datasheet

Bulk - Active Fingerstock - 0.320 (8.13mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper Nickel Flash Adhesive
4695PA51H00100

4695PA51H00100

GK NICU PTAFG PU V0 SQ

Laird Technologies EMI

2,644 0.39
- +

RFQ

4695PA51H00100

Datasheet

Bulk 51H Active Fabric Over Foam Square 0.374 (9.50mm) 1.000 (25.40mm) 0.374 (9.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
67BCG2504303510R00

67BCG2504303510R00

SP,CON,C,AU,TNR

Laird Technologies EMI

2,411 0.39
- +

RFQ

Bulk BCG Active Fingerstock - 0.098 (2.50mm) 0.169 (4.30mm) 0.138 (3.50mm) Beryllium Copper Gold - Solder
4795PA51H00100

4795PA51H00100

GK,NICU,PTAFG,PU,V0,REC .250X.50

Laird Technologies EMI

2,122 0.40
- +

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.500 (12.70mm) 1.000 (25.40mm) 0.250 (6.35mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4157PA51H00100

4157PA51H00100

GK,NICU,PTAFG,PU,V0,REC .060X.28

Laird Technologies EMI

3,378 0.41
- +

RFQ

Bulk ECOGREEN™ Active Fabric Over Foam Rectangle 0.787 (20.00mm) 1.000 (25.40mm) 0.630 (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
67BCG2003201508R00

67BCG2003201508R00

SP,CON,C,AU,TNR

Laird Technologies EMI

2,525 0.44
- +

RFQ

67BCG2003201508R00

Datasheet

Bulk BCG Active Fingerstock - 0.078 (2.00mm) 0.126 (3.20mm) 0.059 (1.50mm) Beryllium Copper Gold - Solder
67BCG2003002508R00

67BCG2003002508R00

SP,CON,C,AU,TNR

Laird Technologies EMI

2,489 0.45
- +

RFQ

Bulk BCG Active - - - - - - - - -
331256381840

331256381840

WE-SECF SMT EMI CONTACT FINGER

Würth Elektronik

2,870 0.45
- +

RFQ

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active Shield Finger, Pre-Loaded - 0.098 (2.50mm) 0.148 (3.75mm) 0.157 (4.00mm) Phosphor Bronze Nickel, Tin - Solder
67SLH060080070PI00

67SLH060080070PI00

METAL FILM OVER FOAM CONTACTS

Laird Technologies EMI

2,883 0.00
- +

RFQ

67SLH060080070PI00

Datasheet

Tape & Reel (TR),Cut Tape (CT) SMD Grounding Metallized Active Film Over Foam Hourglass 0.236 (6.00mm) 0.276 (7.00mm) 0.315 (8.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder
4788PB51H00100

4788PB51H00100

GK,NICU,PTAFG,PU,V0,REC .125X.25

Laird Technologies EMI

3,806 0.46
- +

RFQ

4788PB51H00100

Datasheet

Bulk ECOGREEN™ Active Fabric Over Foam Rectangle 0.250 (6.35mm) 1.000 (25.40mm) 0.125 (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4789PA51H00100

4789PA51H00100

GK NICU PTAFG PU V0 DSH

Laird Technologies EMI

2,383 0.47
- +

RFQ

4789PA51H00100

Datasheet

Bulk 51H Active Fabric Over Foam D-Shape 0.374 (9.50mm) 1.000 (25.40mm) 0.252 (6.40mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
67BCG2003203508R00

67BCG2003203508R00

SP,CON,C,AU,TNR 3.5X2X3.2MM

Laird Technologies EMI

2,494 0.47
- +

RFQ

67BCG2003203508R00

Datasheet

Tape & Reel (TR) BCG Active Shield Finger - 0.079 (2.00mm) 0.126 (3.20mm) 0.138 (3.50mm) Beryllium Copper Nickel, Tin - -
67BCG2004002008R00

67BCG2004002008R00

SP,CON,C,AU,TNR

Laird Technologies EMI

3,323 0.49
- +

RFQ

Bulk BCG Active - - - - - - - - -
67BCG2003004010R00

67BCG2003004010R00

SP,CON,C,AU,TNR

Laird Technologies EMI

3,132 0.49
- +

RFQ

67BCG2003004010R00

Datasheet

Bulk BCG Active - - - - - - - - -
67B5G2504004108R00

67B5G2504004108R00

SP,CON,5,AU,TNR

Laird Technologies EMI

3,692 0.52
- +

RFQ

Bulk B5G Active Fingerstock - 0.098 (2.50mm) 0.157 (4.00mm) 0.161 (4.10mm) Beryllium Copper Gold - Solder
4084AA51K00100

4084AA51K00100

GK NICU NRS PU V0 SQ

Laird Technologies EMI

3,064 0.53
- +

RFQ

4084AA51K00100

Datasheet

Bulk 51K Active Fabric Over Foam Square 0.500 (12.70mm) 1.000 (25.40mm) 0.500 (12.70mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
4181PA51H00200

4181PA51H00200

GK NICU PTAFG PU V0 DSH

Laird Technologies EMI

2,244 0.53
- +

RFQ

4181PA51H00200

Datasheet

Bulk 51H Active Fabric Over Foam D-Shape 0.394 (10.00mm) 2.000 (50.80mm) 0.079 (2.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
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