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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
11-32RH-SN-0.356

11-32RH-SN-0.356

0.11 X 0.32 SN 0.356--11-32RH-SN

Leader Tech Inc.

2,610 0.73
- +

RFQ

11-32RH-SN-0.356

Datasheet

Bulk - Active Fingerstock - 0.320 (8.13mm) 0.356 (9.04mm) 0.110 (2.79mm) Beryllium Copper Tin Flash Adhesive
0D97098319

0D97098319

CGCLIP NIB DLN CLO

Laird Technologies EMI

3,213 0.74
- +

RFQ

Bulk Card Guide Clip-On Active Fingerstock - 0.080 (2.03mm) 0.375 (9.52mm) 0.062 (1.57mm) Beryllium Copper Nickel 299.99µin (7.62µm) Clip
0077003602

0077003602

GASKET BECU 7.87X24.89MM

Laird Technologies EMI

2,236 0.74
- +

RFQ

0077003602

Datasheet

Box Slot Mount Active Fingerstock - 0.310 (7.87mm) 0.980 (24.89mm) 0.120 (3.05mm) Beryllium Copper - - Slot
67B4G2504005410R00

67B4G2504005410R00

SP,CN,4,AU

Laird Technologies EMI

3,539 0.76
- +

RFQ

Bulk - Active Fingerstock - 0.098 (2.50mm) 0.185 (4.70mm) 0.213 (5.40mm) Beryllium Copper Gold - Solder
67SLG060080070PI00

67SLG060080070PI00

METAL FILM OVER FOAM CONTACTS

Laird Technologies EMI

3,835 0.77
- +

RFQ

67SLG060080070PI00

Datasheet

Tape & Reel (TR),Cut Tape (CT) SMD Grounding Metallized Active Film Over Foam Rectangle 0.236 (6.00mm) 0.276 (7.00mm) 0.315 (8.00mm) Polyurethane Foam, Tin-Copper Polyester (SN/CU) - - Solder
0078004402

0078004402

SLMT,6F,BF,USF .110X.320X.187X1.

Laird Technologies EMI

2,989 0.78
- +

RFQ

Bulk - Active - - - - - - - - -
331236362553

331236362553

WE-SECF SMD EMI CONTACT FINGER 3

Würth Elektronik

2,327 0.78
- +

RFQ

331236362553

Datasheet

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active Shield Finger, Pre-Loaded - 0.110 (2.80mm) 0.142 (3.60mm) 0.209 (5.30mm) Phosphor Bronze Nickel - Solder
331265563040

331265563040

WE-SECF SMD EMI CONTACT FINGER 5

Würth Elektronik

2,669 0.78
- +

RFQ

331265563040

Datasheet

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active Shield Finger, Pre-Loaded - 0.118 (3.00mm) 0.220 (5.59mm) 0.157 (4.00mm) Beryllium Copper Nickel - Solder
331151722590

331151722590

WE-SECF SMT EMI CONTACT FINGER

Würth Elektronik

2,362 0.79
- +

RFQ

Tape & Reel (TR),Cut Tape (CT) WE-SECF Active - - - - - - - - Solder
67B3G2003805508R00

67B3G2003805508R00

SZ-SP,CON,AU,TNR

Laird Technologies EMI

3,804 0.00
- +

RFQ

67B3G2003805508R00

Datasheet

Tape & Reel (TR) B3G Active Shield Finger - 0.079 (2.00mm) 0.150 (3.80mm) 0.217 (5.50mm) Beryllium Copper Nickel -
0077009602

0077009602

GASKET BECU 15.24X27.81MM

Laird Technologies EMI

3,934 0.80
- +

RFQ

0077009602

Datasheet

Box Slot Mount Active Fingerstock - 0.600 (15.24mm) 1.096 (27.84mm) 0.220 (5.59mm) Beryllium Copper - - Slot
0078005417

0078005417

SLMT,9F,SNB,USFT

Laird Technologies EMI

2,258 0.81
- +

RFQ

0078005417

Datasheet

Bulk Ultrasoft Slot Mount Active Fingerstock - 0.320 (8.13mm) 1.665 (42.29mm) 0.110 (2.79mm) Beryllium Copper Tin 299.21µin (7.60µm) Slot
4694PA51H00200

4694PA51H00200

GASKET FABR/FOAM 3.3X12.7MM RECT

Laird Technologies EMI

3,490 0.82
- +

RFQ

4694PA51H00200

Datasheet

Bulk - Active Fabric Over Foam Rectangle 0.500 (12.70mm) 2.000 (50.80mm) 0.126 (3.20mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
67B5G2007006215R00

67B5G2007006215R00

SP,CON,5,AU,TNR

Laird Technologies EMI

2,674 0.85
- +

RFQ

Bulk B5G Active - - - - - - - - -
67BCG2004705710R00

67BCG2004705710R00

SP,CON,C,AU,TNR

Laird Technologies EMI

2,902 0.87
- +

RFQ

Bulk BCG Active Fingerstock - 0.079 (2.00mm) 0.185 (4.70mm) 0.224 (5.70mm) Beryllium Copper Gold - Solder
67B8G2004504510R00

67B8G2004504510R00

SP,CON,8,AU,TNR

Laird Technologies EMI

2,485 0.88
- +

RFQ

Bulk - Active - - - - - - - - -
67BCG2004005508R00

67BCG2004005508R00

SMD CONTACT 2.0X4.0X5.5

Laird Technologies EMI

3,721 0.90
- +

RFQ

67BCG2004005508R00

Datasheet

Tape & Reel (TR),Cut Tape (CT) BCG Active - - 0.078 (2.00mm) 0.157 (4.00mm) - - - - -
67B3G2507009010R0B

67B3G2507009010R0B

SP,CON,3,AU,TNR

Laird Technologies EMI

3,150 0.91
- +

RFQ

Bulk B3G Active Fingerstock - 0.098 (2.50mm) 0.276 (7.00mm) 0.354 (9.00mm) Beryllium Copper Gold - Solder
67BCG2006004015R00

67BCG2006004015R00

SP:CON:C:AU:TNR;

Laird Technologies EMI

2,587 0.92
- +

RFQ

67BCG2006004015R00

Datasheet

Tape & Reel (TR) BCG Active Shield Finger - 0.079 (2.00mm) 0.236 (6.00mm) 0.157 (4.00mm) Beryllium Copper Nickel - -
4541AB51H00100

4541AB51H00100

GK,NICU,PTAFG,PU,V0,DSH .050X.25

Laird Technologies EMI

3,484 0.92
- +

RFQ

Bulk 51H Active - - - - - - - - -
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