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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-8870-10WR

14-8870-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,674 4.05
- +

RFQ

14-8870-10WR

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
8114LB603 REV J

8114LB603 REV J

CONN TRANSIST TO-3 4POS TIN

Aavid, Thermal Division of Boyd Corporation

3,383 4.06
- +

RFQ

8114LB603 REV J

Datasheet

Bulk 8180 Active Transistor, TO-3 4 (Oval) - Tin - Brass Through Hole Closed Frame Solder - Tin - Brass Phenolic
24-4518-00

24-4518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,894 4.07
- +

RFQ

24-4518-00

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-00

17-0518-00

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,321 4.07
- +

RFQ

17-0518-00

Datasheet

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-1518-10T

32-1518-10T

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,924 4.07
- +

RFQ

32-1518-10T

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
35-0518-10

35-0518-10

CONN SOCKET SIP 35POS GOLD

Aries Electronics

3,655 4.07
- +

RFQ

35-0518-10

Datasheet

Bulk 518 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-624-41-004101

116-87-624-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,506 3.83
- +

RFQ

116-87-624-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-316-T-A

APA-316-T-A

ADAPTER PLUG

Samtec Inc.

2,562 4.07
- +

RFQ

Bulk APA Active - 16 (2 x 8) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-83-640-41-003101

116-83-640-41-003101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2,293 3.84
- +

RFQ

116-83-640-41-003101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-012101

116-83-636-41-012101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,780 3.84
- +

RFQ

116-83-636-41-012101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
07-0503-20

07-0503-20

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,020 4.09
- +

RFQ

07-0503-20

Datasheet

Bulk 0503 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
07-0503-30

07-0503-30

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,759 4.09
- +

RFQ

07-0503-30

Datasheet

Bulk 0503 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
14-0518-11H

14-0518-11H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,735 4.09
- +

RFQ

14-0518-11H

Datasheet

Bulk 518 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-1518-11H

14-1518-11H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,400 4.09
- +

RFQ

14-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-0518-10T

32-0518-10T

CONN SOCKET SIP 32POS GOLD

Aries Electronics

2,792 4.09
- +

RFQ

32-0518-10T

Datasheet

Bulk 518 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-642-41-018101

116-83-642-41-018101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2,762 3.85
- +

RFQ

116-83-642-41-018101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-964-41-001101

110-83-964-41-001101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

3,435 3.85
- +

RFQ

110-83-964-41-001101

Datasheet

Bulk 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-636-41-035101

146-83-636-41-035101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,888 4.11
- +

RFQ

146-83-636-41-035101

Datasheet

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-636-41-036101

146-83-636-41-036101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2,133 4.11
- +

RFQ

146-83-636-41-036101

Datasheet

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-128-13-041101

510-87-128-13-041101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

2,002 3.86
- +

RFQ

510-87-128-13-041101

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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