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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-179-18-111101

510-87-179-18-111101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

3,203 5.40
- +

RFQ

510-87-179-18-111101

Datasheet

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
07-0511-10

07-0511-10

CONN SOCKET SIP 7POS TIN

Aries Electronics

2,023 5.75
- +

RFQ

07-0511-10

Datasheet

Bulk 511 Active SIP 7 (1 x 7) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-180-17-081101

510-87-180-17-081101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

2,504 5.43
- +

RFQ

510-87-180-17-081101

Datasheet

Bulk 510 Active PGA 180 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-18-111101

510-87-180-18-111101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

2,453 5.43
- +

RFQ

510-87-180-18-111101

Datasheet

Bulk 510 Active PGA 180 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-15-001101

510-87-180-15-001101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

2,752 5.43
- +

RFQ

510-87-180-15-001101

Datasheet

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-180-15-041101

510-87-180-15-041101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

2,402 5.43
- +

RFQ

510-87-180-15-041101

Datasheet

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-656-41-105101

117-83-656-41-105101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip

3,755 5.43
- +

RFQ

117-83-656-41-105101

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-011101

116-83-636-41-011101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,568 5.43
- +

RFQ

116-83-636-41-011101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-3508-20

08-3508-20

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,574 5.77
- +

RFQ

08-3508-20

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3508-30

08-3508-30

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,167 5.77
- +

RFQ

08-3508-30

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-101

20-3518-101

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,114 5.77
- +

RFQ

20-3518-101

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6513-10T

40-6513-10T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,069 5.77
- +

RFQ

40-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-129-41-013000

346-93-129-41-013000

CONN SOCKET SIP 29POS GOLD

Mill-Max Manufacturing Corp.

2,003 5.77
- +

RFQ

346-93-129-41-013000

Datasheet

Bulk 346 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-129-41-013000

346-43-129-41-013000

CONN SOCKET SIP 29POS GOLD

Mill-Max Manufacturing Corp.

2,807 5.77
- +

RFQ

346-43-129-41-013000

Datasheet

Bulk 346 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-87-180-15-002101

510-87-180-15-002101

CONN SOCKET PGA 180POS GOLD

Preci-Dip

2,028 5.43
- +

RFQ

510-87-180-15-002101

Datasheet

Bulk 510 Active PGA 180 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-004101

116-83-432-41-004101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3,717 5.45
- +

RFQ

116-83-432-41-004101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-007101

116-83-648-41-007101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,500 6.09
- +

RFQ

116-83-648-41-007101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-002101

116-87-648-41-002101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3,349 5.46
- +

RFQ

116-87-648-41-002101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-114-13-001101

510-83-114-13-001101

CONN SOCKET PGA 114POS GOLD

Preci-Dip

3,244 5.46
- +

RFQ

510-83-114-13-001101

Datasheet

Bulk 510 Active PGA 114 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-114-13-061101

510-83-114-13-061101

CONN SOCKET PGA 114POS GOLD

Preci-Dip

2,173 5.46
- +

RFQ

510-83-114-13-061101

Datasheet

Bulk 510 Active PGA 114 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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