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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
25-0518-00

25-0518-00

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3,355 6.37
- +

RFQ

25-0518-00

Datasheet

Bulk 518 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-0518-11

36-0518-11

CONN SOCKET SIP 36POS GOLD

Aries Electronics

3,944 6.37
- +

RFQ

36-0518-11

Datasheet

Bulk 518 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0508-20

13-0508-20

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,654 6.37
- +

RFQ

13-0508-20

Datasheet

Bulk 508 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
13-0508-30

13-0508-30

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2,439 6.37
- +

RFQ

13-0508-30

Datasheet

Bulk 508 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
06-6820-90C

06-6820-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

3,234 6.37
- +

RFQ

06-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6822-90C

06-6822-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,850 6.37
- +

RFQ

06-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6823-90C

06-6823-90C

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,551 6.37
- +

RFQ

06-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
124-83-642-41-002101

124-83-642-41-002101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2,202 6.03
- +

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-3501-21

08-3501-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,360 6.39
- +

RFQ

08-3501-21

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-3501-31

08-3501-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,191 6.39
- +

RFQ

08-3501-31

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
ICO-314-CGT

ICO-314-CGT

100 LOW PROFILE SCREW MACHINE D

Samtec Inc.

2,876 6.40
- +

RFQ

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
510-87-207-17-081101

510-87-207-17-081101

CONN SOCKET PGA 207POS GOLD

Preci-Dip

3,807 6.06
- +

RFQ

510-87-207-17-081101

Datasheet

Bulk 510 Active PGA 207 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-207-17-082101

510-87-207-17-082101

CONN SOCKET PGA 207POS GOLD

Preci-Dip

2,406 6.06
- +

RFQ

510-87-207-17-082101

Datasheet

Bulk 510 Active PGA 207 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
18-3518-111

18-3518-111

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,612 6.41
- +

RFQ

18-3518-111

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-102

20-3518-102

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,838 6.41
- +

RFQ

20-3518-102

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-6511-10

36-6511-10

CONN IC DIP SOCKET 36POS TIN

Aries Electronics

3,358 6.41
- +

RFQ

36-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
299-87-626-10-002101

299-87-626-10-002101

CONN IC DIP SOCKET 26POS GOLD

Preci-Dip

3,273 6.09
- +

RFQ

299-87-626-10-002101

Datasheet

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-208-17-081101

510-87-208-17-081101

CONN SOCKET PGA 208POS GOLD

Preci-Dip

2,291 6.09
- +

RFQ

510-87-208-17-081101

Datasheet

Bulk 510 Active PGA 208 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-640-T-J

APA-640-T-J

ADAPTER PLUG

Samtec Inc.

3,638 6.45
- +

RFQ

Tube APA Active - 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
07-0503-21

07-0503-21

CONN SOCKET SIP 7POS GOLD

Aries Electronics

3,317 6.46
- +

RFQ

07-0503-21

Datasheet

Bulk 0503 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
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