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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
26-1518-11H

26-1518-11H

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

2,988 7.69
- +

RFQ

26-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-148-15-061101

510-83-148-15-061101

CONN SOCKET PGA 148POS GOLD

Preci-Dip

2,834 7.31
- +

RFQ

510-83-148-15-061101

Datasheet

Bulk 510 Active PGA 148 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-148-15-062101

510-83-148-15-062101

CONN SOCKET PGA 148POS GOLD

Preci-Dip

3,208 7.31
- +

RFQ

510-83-148-15-062101

Datasheet

Bulk 510 Active PGA 148 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-823-90T

16-823-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3,539 7.74
- +

RFQ

16-823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
510-83-169-13-000101

510-83-169-13-000101

CONN SOCKET PGA 169POS GOLD

Preci-Dip

2,071 7.33
- +

RFQ

510-83-169-13-000101

Datasheet

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-068-11-061135

546-83-068-11-061135

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3,736 7.34
- +

RFQ

546-83-068-11-061135

Datasheet

Bulk 546 Active PGA 68 (11 x 11) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-068-11-061136

546-83-068-11-061136

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2,466 7.34
- +

RFQ

546-83-068-11-061136

Datasheet

Bulk 546 Active PGA 68 (11 x 11) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-149-15-003101

510-83-149-15-003101

CONN SOCKET PGA 149POS GOLD

Preci-Dip

3,124 7.36
- +

RFQ

510-83-149-15-003101

Datasheet

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-1518-00

32-1518-00

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,222 7.84
- +

RFQ

32-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0511-10

19-0511-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

3,739 7.84
- +

RFQ

19-0511-10

Datasheet

Bulk 511 Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3513-11H

18-3513-11H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,029 7.85
- +

RFQ

18-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6823-90T

14-6823-90T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,929 7.85
- +

RFQ

14-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
612-91-304-41-003000

612-91-304-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,558 8.17
- +

RFQ

612-91-304-41-003000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-3518-11H

20-3518-11H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,001 8.18
- +

RFQ

20-3518-11H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3503-21

08-3503-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,333 8.18
- +

RFQ

08-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-3503-31

08-3503-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,660 8.18
- +

RFQ

08-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
123-47-304-41-001000

123-47-304-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

3,301 8.25
- +

RFQ

123-47-304-41-001000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-169-17-101101

510-83-169-17-101101

CONN SOCKET PGA 169POS GOLD

Preci-Dip

3,525 7.84
- +

RFQ

510-83-169-17-101101

Datasheet

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-159-16-071101

510-83-159-16-071101

CONN SOCKET PGA 159POS GOLD

Preci-Dip

3,723 7.85
- +

RFQ

510-83-159-16-071101

Datasheet

Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
48-6513-11

48-6513-11

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,038 8.29
- +

RFQ

48-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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