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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
05-0501-21

05-0501-21

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2,810 8.13
- +

RFQ

05-0501-21

Datasheet

Bulk 501 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-0501-31

05-0501-31

CONN SOCKET SIP 5POS GOLD

Aries Electronics

3,628 8.13
- +

RFQ

05-0501-31

Datasheet

Bulk 501 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
121-11-304-41-001000

121-11-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,711 8.14
- +

RFQ

121-11-304-41-001000

Datasheet

Tube 121 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-304-41-001000

612-41-304-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,668 8.14
- +

RFQ

612-41-304-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-304-41-001000

612-91-304-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,211 8.14
- +

RFQ

612-91-304-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-304-31-007000

614-93-304-31-007000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

3,048 8.14
- +

RFQ

614-93-304-31-007000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-304-31-007000

614-43-304-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,609 8.14
- +

RFQ

614-43-304-31-007000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-056-09-041101

550-10-056-09-041101

PGA SOLDER TAIL

Preci-Dip

2,900 7.73
- +

RFQ

550-10-056-09-041101

Datasheet

Bulk 550 Active PGA 56 (9 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-43-622-10-002000

299-43-622-10-002000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3,673 8.16
- +

RFQ

299-43-622-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-304-41-003000

612-41-304-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,664 8.17
- +

RFQ

612-41-304-41-003000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-810-90TWR

14-810-90TWR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,303 8.18
- +

RFQ

14-810-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
714-43-129-31-018000

714-43-129-31-018000

CONN SOCKET SIP 29POS GOLD

Mill-Max Manufacturing Corp.

3,524 8.18
- +

RFQ

714-43-129-31-018000

Datasheet

Bulk 714 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-304-31-002000

614-43-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,709 8.19
- +

RFQ

614-43-304-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-304-31-002000

614-93-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,973 8.19
- +

RFQ

614-93-304-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
29-0518-11H

29-0518-11H

CONN SOCKET SIP 29POS GOLD

Aries Electronics

2,737 8.20
- +

RFQ

29-0518-11H

Datasheet

Bulk 518 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-143-41-013000

346-93-143-41-013000

CONN SOCKET SIP 43POS GOLD

Mill-Max Manufacturing Corp.

3,768 8.21
- +

RFQ

346-93-143-41-013000

Datasheet

Bulk 346 Active SIP 43 (1 x 43) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-143-41-013000

346-43-143-41-013000

CONN SOCKET SIP 43POS GOLD

Mill-Max Manufacturing Corp.

2,629 8.21
- +

RFQ

346-43-143-41-013000

Datasheet

Bulk 346 Active SIP 43 (1 x 43) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-304-41-001000

614-93-304-41-001000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

3,842 8.21
- +

RFQ

614-93-304-41-001000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-304-41-001000

614-43-304-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,322 8.21
- +

RFQ

614-43-304-41-001000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
23-0511-10

23-0511-10

CONN SOCKET SIP 23POS TIN

Aries Electronics

3,084 8.22
- +

RFQ

23-0511-10

Datasheet

Bulk 511 Active SIP 23 (1 x 23) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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