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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
25-0508-30

25-0508-30

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2,442 10.42
- +

RFQ

25-0508-30

Datasheet

Bulk 508 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
346-93-157-41-013000

346-93-157-41-013000

CONN SOCKET SIP 57POS GOLD

Mill-Max Manufacturing Corp.

3,879 10.43
- +

RFQ

346-93-157-41-013000

Datasheet

Bulk 346 Active SIP 57 (1 x 57) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-157-41-013000

346-43-157-41-013000

CONN SOCKET SIP 57POS GOLD

Mill-Max Manufacturing Corp.

2,069 10.43
- +

RFQ

346-43-157-41-013000

Datasheet

Bulk 346 Active SIP 57 (1 x 57) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
08-0511-11

08-0511-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2,706 10.44
- +

RFQ

08-0511-11

Datasheet

Bulk 511 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-11H

24-3513-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,325 10.44
- +

RFQ

24-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6513-10H

40-6513-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,508 10.46
- +

RFQ

40-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-71000-10

11-71000-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

2,562 10.46
- +

RFQ

11-71000-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-7400-10

11-7400-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

3,287 10.46
- +

RFQ

11-7400-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-7587-10

11-7587-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

2,751 10.46
- +

RFQ

11-7587-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-6621-30

08-6621-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3,894 10.46
- +

RFQ

08-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-111

40-6518-111

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,215 10.47
- +

RFQ

40-6518-111

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0517-90C

25-0517-90C

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2,395 10.47
- +

RFQ

25-0517-90C

Datasheet

Bulk 0517 Active SIP 25 (1 x 25) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0501-20

14-0501-20

CONN SOCKET SIP 14POS TIN

Aries Electronics

2,330 10.48
- +

RFQ

14-0501-20

Datasheet

Bulk 501 Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-0501-30

14-0501-30

CONN SOCKET SIP 14POS TIN

Aries Electronics

2,466 10.48
- +

RFQ

14-0501-30

Datasheet

Bulk 501 Active SIP 14 (1 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-9513-11

30-9513-11

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,341 10.48
- +

RFQ

30-9513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0508-21

13-0508-21

CONN SOCKET SIP 13POS GOLD

Aries Electronics

3,304 10.48
- +

RFQ

13-0508-21

Datasheet

Bulk 508 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
13-0508-31

13-0508-31

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2,498 10.48
- +

RFQ

13-0508-31

Datasheet

Bulk 508 Active SIP 13 (1 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
18-3508-201

18-3508-201

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,578 10.48
- +

RFQ

18-3508-201

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3508-301

18-3508-301

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,395 10.48
- +

RFQ

18-3508-301

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-6823-90

14-6823-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,240 10.48
- +

RFQ

14-6823-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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