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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-012-05-001002

510-13-012-05-001002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,147 20.23
- +

RFQ

510-13-012-05-001002

Datasheet

Bulk 510 Active PGA 12 (5 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-652-41-001000

116-43-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,013 20.24
- +

RFQ

116-43-652-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-47-952-41-001000

123-47-952-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,623 20.25
- +

RFQ

123-47-952-41-001000

Datasheet

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-41-656-41-003000

127-41-656-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,075 20.25
- +

RFQ

127-41-656-41-003000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-656-41-003000

127-91-656-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,505 20.25
- +

RFQ

127-91-656-41-003000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-952-41-001000

612-93-952-41-001000

SOCKET CARRIER SLDRTL .900 52POS

Mill-Max Manufacturing Corp.

2,303 20.25
- +

RFQ

612-93-952-41-001000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-648-41-001000

612-11-648-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,997 20.25
- +

RFQ

612-11-648-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-952-41-001000

612-43-952-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,076 20.25
- +

RFQ

612-43-952-41-001000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
25-0503-21

25-0503-21

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3,391 20.26
- +

RFQ

25-0503-21

Datasheet

Bulk 0503 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
25-0503-31

25-0503-31

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3,726 20.26
- +

RFQ

25-0503-31

Datasheet

Bulk 0503 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
18-3508-211

18-3508-211

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,459 20.26
- +

RFQ

18-3508-211

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3508-311

18-3508-311

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,114 20.26
- +

RFQ

18-3508-311

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
111-93-314-61-001000

111-93-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,193 20.26
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
510-83-441-21-000101

510-83-441-21-000101

CONN SOCKET PGA 441POS GOLD

Preci-Dip

3,622 19.13
- +

RFQ

510-83-441-21-000101

Datasheet

Bulk 510 Active PGA 441 (21 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
23-0511-11

23-0511-11

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3,533 20.27
- +

RFQ

23-0511-11

Datasheet

Bulk 511 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6556-30

40-6556-30

40 POS TEST SOCK RECEPT SOLDER

Aries Electronics

2,800 20.28
- +

RFQ

- 6556 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
40-6556-20

40-6556-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,400 20.28
- +

RFQ

40-6556-20

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
110-43-420-61-001000

110-43-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,600 20.28
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-420-61-001000

110-93-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,801 20.28
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
517-83-320-19-131111

517-83-320-19-131111

CONN SOCKET PGA 320POS GOLD

Preci-Dip

2,203 19.14
- +

RFQ

517-83-320-19-131111

Datasheet

Bulk 517 Active PGA 320 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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