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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
D01-9970342 CONN SOCKET SIP 3POS GOLD Harwin Inc.	3,974	0.23	- + RFQ	Datasheet	Tube	D01-997	Active	SIP	3 (1 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
116-87-304-41-018101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	3,066	0.21	- + RFQ	Datasheet	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 10-HZL-TT CONN IC DIP SOCKET 10POS GOLD Assmann WSW Components	3,408	0.24	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	Flash	Brass	Polybutylene Terephthalate (PBT), Glass Filled
114-83-304-41-117101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	3,843	0.22	- + RFQ	Datasheet	Bulk	114	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-304-31-012101 CONN IC DIP SOCKET 320POS GOLD Preci-Dip	2,992	0.22	- + RFQ	Datasheet	Bulk	614	Active	DIP, 0.3 (7.62mm) Row Spacing	320 (19 x 19)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Carrier, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D01-9970242 CONN SOCKET SIP 2POS GOLD Harwin Inc.	3,430	0.24	- + RFQ	Datasheet	Bulk	D01-997	Active	SIP	2 (1 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Threaded	-	Solder	0.100 (2.54mm)	Tin	196.9µin (5.00µm)	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
AW 127-15/Z-T SOCKET 15 CONTACTS SINGLE ROW Assmann WSW Components	2,175	0.24	- + RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-87-304-41-003101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	2,585	0.23	- + RFQ	Datasheet	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-14/Z-T SOCKET 14 CONTACTS SINGLE ROW Assmann WSW Components	2,401	0.25	- + RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AW 127-16/Z-T SOCKET 16 CONTACTS SINGLE ROW Assmann WSW Components	2,249	0.26	- + RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
114-87-306-41-117101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	2,041	0.24	- + RFQ	Datasheet	Bulk	114	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-306-41-134161 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,458	0.24	- + RFQ	Datasheet	Bulk	114	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-306-41-003101 CONN IC DIP SOCKET 6POS GOLD Preci-Dip	3,167	0.25	- + RFQ	Datasheet	Bulk	115	Active	DIP, 0.3 (7.62mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
A 28-LC-TR01 28 (2 X 14) POS DIP, 0.3 (7.62M Assmann WSW Components	3,461	0.27	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
110-87-308-41-605101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	3,806	0.26	- + RFQ	Datasheet	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-308-41-005101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	2,645	0.26	- + RFQ	Datasheet	Bulk	110	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-012101 CONN IC DIP SOCKET 4POS GOLD Preci-Dip	3,808	0.26	- + RFQ	Datasheet	Bulk	116	Active	DIP, 0.3 (7.62mm) Row Spacing	4 (2 x 2)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Elevated, Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-17/Z-T SOCKET 17 CONTACTS SINGLE ROW Assmann WSW Components	3,106	0.27	- + RFQ	Datasheet	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
01-0513-10 CONN SOCKET SIP 1POS GOLD Aries Electronics	2,106	0.28	- + RFQ	Datasheet	Bulk	0513	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
01-0513-10T CONN SOCKET SIP 1POS GOLD Aries Electronics	3,211	0.28	- + RFQ	Datasheet	Bulk	0513	Active	SIP	1 (1 x 1)	-	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled