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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-43-648-41-003000

126-43-648-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,405 22.09
- +

RFQ

126-43-648-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-320-61-007000

116-43-320-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,436 22.11
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-420-61-007000

116-43-420-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,965 22.11
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-320-61-007000

116-93-320-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,516 22.11
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-420-61-007000

116-93-420-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,687 22.11
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
550-10-192M16-001152

550-10-192M16-001152

BGA SOLDER TAIL

Preci-Dip

3,886 20.75
- +

RFQ

550-10-192M16-001152

Datasheet

Bulk 550 Active BGA 192 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
123-11-652-41-001000

123-11-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,370 22.13
- +

RFQ

123-11-652-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-83-369-18-091111

517-83-369-18-091111

CONN SOCKET PGA 369POS GOLD

Preci-Dip

3,190 20.74
- +

RFQ

517-83-369-18-091111

Datasheet

Bulk 517 Active PGA 369 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-44-952-61-001000

110-44-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,842 22.15
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-952-61-001000

110-99-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,641 22.15
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
612-13-950-41-001000

612-13-950-41-001000

SOCKET CARRIER SLDRTL .900 50POS

Mill-Max Manufacturing Corp.

2,676 22.17
- +

RFQ

612-13-950-41-001000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-41-764-41-003000

127-41-764-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,460 22.20
- +

RFQ

127-41-764-41-003000

Datasheet

Tube 127 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-764-41-003000

127-91-764-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,271 22.20
- +

RFQ

127-91-764-41-003000

Datasheet

Tube 127 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-964-41-001000

123-91-964-41-001000

SOCKET IC OPEN 3 LVL .900 64POS

Mill-Max Manufacturing Corp.

3,974 22.20
- +

RFQ

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-964-41-001000

123-41-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,056 22.20
- +

RFQ

123-41-964-41-001000

Datasheet

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
64-9513-11H

64-9513-11H

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

3,359 22.20
- +

RFQ

64-9513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-43-642-61-001000

110-43-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,628 22.21
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-642-61-001000

110-93-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,061 22.21
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
510-91-044-08-031001

510-91-044-08-031001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,420 22.21
- +

RFQ

510-91-044-08-031001

Datasheet

Bulk 510 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-044-08-031002

510-91-044-08-031002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,920 22.21
- +

RFQ

510-91-044-08-031002

Datasheet

Bulk 510 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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