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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-13-624-61-801000

110-13-624-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,573 25.36
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
117-43-652-61-005000

117-43-652-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,662 25.36
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
117-93-652-61-005000

117-93-652-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,591 25.36
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-640-61-007000

116-43-640-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,968 25.36
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-640-61-007000

116-93-640-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,070 25.36
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
518-77-192M16-001106

518-77-192M16-001106

CONN SOCKET PGA 192POS GOLD

Preci-Dip

3,444 23.84
- +

RFQ

518-77-192M16-001106

Datasheet

Bulk 518 Active PGA 192 (16 x 16) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
115-43-950-61-001000

115-43-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,012 25.42
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-950-61-001000

115-93-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,728 25.42
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
510-91-092-11-041001

510-91-092-11-041001

SOCKET SOLDERTAIL 92-PGA

Mill-Max Manufacturing Corp.

2,602 25.43
- +

RFQ

Bulk 510 Active PGA 92 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-092-11-041002

510-91-092-11-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,827 25.43
- +

RFQ

510-91-092-11-041002

Datasheet

Bulk 510 Active PGA 92 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-092-11-041003

510-91-092-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,329 25.43
- +

RFQ

510-91-092-11-041003

Datasheet

Bulk 510 Active PGA 92 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-964-41-001000

122-11-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,164 25.44
- +

RFQ

122-11-964-41-001000

Datasheet

Tube 122 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6574-11

32-6574-11

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

3,832 25.45
- +

RFQ

32-6574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-6572-11

32-6572-11

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

3,670 25.45
- +

RFQ

32-6572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
50-9518-10E

50-9518-10E

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

2,853 25.49
- +

RFQ

50-9518-10E

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6503-21

32-6503-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,254 25.52
- +

RFQ

32-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6503-31

32-6503-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,712 25.52
- +

RFQ

32-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
110-13-652-61-001000

110-13-652-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,798 25.53
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
123-13-640-41-801000

123-13-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2,854 25.56
- +

RFQ

123-13-640-41-801000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-4508-21

22-4508-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,875 25.58
- +

RFQ

22-4508-21

Datasheet

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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