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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-93-089-13-082002SKT PGA SOLDRTL |
3,686 | 27.19 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 89 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-089-13-082003SKT PGA SOLDRTL |
3,180 | 27.19 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 89 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-089-13-082001SOCKET SOLDERTAIL 89-PGA |
2,844 | 27.19 |
RFQ |
Tube | 510 | Active | PGA | 89 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
32-9503-21CONN IC DIP SOCKET 32POS GOLD |
2,680 | 27.19 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-9503-31CONN IC DIP SOCKET 32POS GOLD |
2,866 | 27.19 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
36-0511-11CONN SOCKET SIP 36POS GOLD |
2,291 | 27.21 |
RFQ |
Datasheet |
Bulk | 511 | Active | SIP | 36 (1 x 36) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-13-632-61-801000CONN IC SKT DBL |
2,857 | 27.22 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
117-43-448-61-105000CONN IC SKT DBL |
3,411 | 27.22 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
117-43-648-61-105000CONN IC SKT DBL |
2,484 | 27.22 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
34-3503-21CONN IC DIP SOCKET 34POS GOLD |
2,186 | 27.26 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 34 (2 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-3503-31CONN IC DIP SOCKET 34POS GOLD |
3,478 | 27.26 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 34 (2 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
116-43-648-61-008000CONN IC SKT DBL |
2,834 | 27.35 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-648-61-008000CONN IC SKT DBL |
3,734 | 27.35 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
APA-632-G-QADAPTER PLUG |
2,170 | 27.35 |
RFQ |
Tube | APA | Active | - | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
116-43-642-61-001000CONN IC SKT DBL |
3,647 | 27.39 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-642-61-001000CONN IC SKT DBL |
3,724 | 27.39 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
64-9503-20CONN IC DIP SOCKET 64POS GOLD |
3,679 | 27.39 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
64-9503-30CONN IC DIP SOCKET 64POS GOLD |
3,222 | 27.39 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
100-PGM13061-11CONN SOCKET PGA GOLD |
3,076 | 27.43 |
RFQ |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
100-PGM13069-11CONN SOCKET PGA GOLD |
3,713 | 27.43 |
RFQ |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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