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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-316-41-605101

110-83-316-41-605101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,950 0.86
- +

RFQ

110-83-316-41-605101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-0513-10T

06-0513-10T

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,553 0.91
- +

RFQ

06-0513-10T

Datasheet

Bulk 0513 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0503-21

01-0503-21

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,913 0.91
- +

RFQ

01-0503-21

Datasheet

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
01-0503-31

01-0503-31

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,908 0.91
- +

RFQ

01-0503-31

Datasheet

Bulk 0503 Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Gold 30.0µin (0.76µm) Brass Polyamide (PA), Nylon, Glass Filled
540-88-020-17-400

540-88-020-17-400

CONN SOCKET PLCC 20POS TIN

Preci-Dip

2,802 0.86
- +

RFQ

540-88-020-17-400

Datasheet

Bulk 540 Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
116-87-316-41-018101

116-87-316-41-018101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,283 0.91
- +

RFQ

116-87-316-41-018101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-422-41-117101

114-87-422-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,011 0.88
- +

RFQ

114-87-422-41-117101

Datasheet

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-328-01-777101

110-87-328-01-777101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,205 0.88
- +

RFQ

110-87-328-01-777101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14), 14 Loaded 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-322-41-117101

114-87-322-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3,993 0.88
- +

RFQ

114-87-322-41-117101

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
03-0518-11H

03-0518-11H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,351 0.96
- +

RFQ

03-0518-11H

Datasheet

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
07-0518-10H

07-0518-10H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

2,775 0.98
- +

RFQ

07-0518-10H

Datasheet

Bulk 518 Active SIP 7 (1 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0508-21

01-0508-21

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,821 0.98
- +

RFQ

01-0508-21

Datasheet

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
01-0508-31

01-0508-31

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,783 0.98
- +

RFQ

01-0508-31

Datasheet

Bulk 508 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
D01-9972142

D01-9972142

CONN SOCKET SIP 21POS GOLD

Harwin Inc.

2,449 0.98
- +

RFQ

D01-9972142

Datasheet

Tube D01-997 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
122-83-310-41-001101

122-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,896 0.91
- +

RFQ

122-83-310-41-001101

Datasheet

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-308-41-117101

114-83-308-41-117101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,134 0.45
- +

RFQ

114-83-308-41-117101

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-308-41-134161

114-83-308-41-134161

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,981 0.45
- +

RFQ

114-83-308-41-134161

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-306-41-035101

146-87-306-41-035101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,503 0.47
- +

RFQ

146-87-306-41-035101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-306-41-036101

146-87-306-41-036101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,571 0.47
- +

RFQ

146-87-306-41-036101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-018101

116-83-306-41-018101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2,347 0.45
- +

RFQ

116-83-306-41-018101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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