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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
36-6554-16CONN IC DIP SOCKET ZIF 36POS |
3,854 | 65.73 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
514-83-576M30-001148CONN SOCKET BGA 576POS GOLD |
3,323 | 63.16 |
RFQ |
Datasheet |
Bulk | 514 | Active | BGA | 576 (30 x 30) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
24-3518-11HCONN IC DIP SOCKET 24POS GOLD |
3,053 | 65.94 |
RFQ |
Datasheet |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
1109042537 ZIF TEST SCKT LIVE BUG TYPE |
3,298 | 66.02 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
1109043538 ZIF TEST SCKT LIVE BUG TYPE |
3,330 | 66.02 |
RFQ |
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
518-77-500M30-001106CONN SOCKET PGA 500POS GOLD |
2,755 | 63.52 |
RFQ |
Datasheet |
Bulk | 518 | Active | PGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
44-6556-41CONN IC DIP SOCKET 44POS GOLD |
3,785 | 66.24 |
RFQ |
Datasheet |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
550-10-576M30-001152BGA SOLDER TAIL |
2,660 | 63.69 |
RFQ |
Datasheet |
Bulk | 550 | Active | BGA | 576 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-504M29-001106CONN SOCKET PGA 504POS GOLD |
3,945 | 64.03 |
RFQ |
Datasheet |
Bulk | 518 | Active | PGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
510-13-299-20-096003PIN GRID ARRAY SOCKETS |
3,743 | 66.99 |
RFQ |
Tube | 510 | Active | PGA | 299 (20 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-13-299-20-096001SKT PGA SOLDRTL |
2,882 | 66.99 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 299 (20 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-299-20-096002SKT PGA SOLDRTL |
3,181 | 66.99 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 299 (20 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
558-10-520M31-001104BGA SURFACE MOUNT 1.27MM |
3,260 | 64.59 |
RFQ |
Datasheet |
Bulk | 558 | Active | BGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-520M31-001105CONN SOCKET PGA 520POS GOLD |
2,758 | 64.85 |
RFQ |
Datasheet |
Bulk | 518 | Active | PGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
209-PGM17020-10HCONN SOCKET PGA GOLD |
2,009 | 67.91 |
RFQ |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
558-10-560M33-001101PGA SOLDER TAIL 1.27MM |
3,771 | 65.50 |
RFQ |
Datasheet |
Bulk | 558 | Active | PGA | 560 (33 x 33) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
48-6556-41CONN IC DIP SOCKET 48POS GOLD |
2,827 | 68.44 |
RFQ |
Datasheet |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
514-83-600M35-001148CONN SOCKET BGA 600POS GOLD |
2,823 | 65.79 |
RFQ |
Datasheet |
Bulk | 514 | Active | BGA | 600 (35 x 35) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-520M31-001106CONN SOCKET PGA 520POS GOLD |
3,632 | 66.06 |
RFQ |
Datasheet |
Bulk | 518 | Active | PGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
40-6554-16CONN IC DIP SOCKET ZIF 40POS |
3,692 | 68.99 |
RFQ |
Datasheet |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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