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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
256-PRS16001-12

256-PRS16001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,923 116.84
- +

RFQ

256-PRS16001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
32-3551-18

32-3551-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3,954 118.06
- +

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-3552-18

32-3552-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3,002 118.06
- +

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-3553-18

32-3553-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3,145 118.06
- +

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-6554-18

32-6554-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

2,719 118.06
- +

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
48-6571-18

48-6571-18

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2,161 119.13
- +

RFQ

48-6571-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
162-PLS20020-12

162-PLS20020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,646 119.26
- +

RFQ

162-PLS20020-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
162-PRS20020-12

162-PRS20020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,750 119.26
- +

RFQ

162-PRS20020-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
164-PRS21013-12

164-PRS21013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,810 119.73
- +

RFQ

164-PRS21013-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
244-5205-00

244-5205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

3M

2,802 120.29
- +

RFQ

Box - Active - - - - - - - - - - - - - -
256-5205-01

256-5205-01

3M TEXTOOL 256-5205-01 QFN .5 MM

3M

2,578 120.35
- +

RFQ

Bulk * Active - - - - - - - - - - - - - -
268-4204-00

268-4204-00

3M TEXTOOL 268-4204-00 QFN.4 MM

3M

2,484 120.67
- +

RFQ

Bulk * Active - - - - - - - - - - - - - -
28-3574-18

28-3574-18

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

2,686 120.70
- +

RFQ

28-3574-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6572-18

28-6572-18

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3,979 120.70
- +

RFQ

28-6572-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6573-18

28-6573-18

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3,837 120.70
- +

RFQ

28-6573-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6574-18

28-6574-18

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3,247 120.70
- +

RFQ

28-6574-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
260-5204-01

260-5204-01

CONN SOCKET QFN 60POS GOLD

3M

2,726 121.35
- +

RFQ

260-5204-01

Datasheet

Bulk Textool™ Active QFN 60 (4 x 15) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020 (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES)
223-PLS18017-12

223-PLS18017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,887 121.82
- +

RFQ

223-PLS18017-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
223-PLS18039-12

223-PLS18039-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,259 121.82
- +

RFQ

223-PLS18039-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
223-PRS18017-12

223-PRS18017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,634 121.82
- +

RFQ

223-PRS18017-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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