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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
822473-4CONN SOCKET PLCC 44POS TIN-LEAD |
2,703 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin-Lead | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | Thermoplastic |
|
AW-127A-20-ZCONN SOCKET SIP 20POS TIN |
3,592 | 0.00 |
RFQ |
Datasheet |
- | - | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Tin | 78.7µin (2.00µm) | - | Through Hole | Closed Frame | - | - | - | - | - | - |
|
|
232-1297-00-3303CONN IC DIP SOCKET ZIF 32POS GLD |
3,849 | 0.00 |
RFQ |
Datasheet |
Tube | OEM | Obsolete | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 250.0µin (6.35µm) | Beryllium Copper | Polyether Imide (PEI), Glass Filled |
|
|
22-16-4CONN TRANSIST TO-5 4POS GOLD |
2,470 | 3.47 |
RFQ |
Bulk,Bulk | 22 | Obsolete | Transistor, TO-5 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Thermoplastic, Glass Filled | |
|
|
60-1518-10CONN IC DIP SOCKET 60POS GOLD |
2,804 | 0.00 |
RFQ |
Datasheet |
Bulk | 518 | Obsolete | DIP, 0.2 (5.08mm) Row Spacing | 60 (2 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
390261-3CONN IC DIP SOCKET 14POS TINLEAD |
2,608 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | - |
|
|
AR06-HZL/01-TTCONN IC DIP SOCKET 6POS GOLD |
2,629 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR08-HZL/01-TTCONN IC DIP SOCKET 8POS GOLD |
3,320 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR14-HZL/01-TTCONN IC DIP SOCKET 14POS GOLD |
2,716 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR16-HZL/01-TTCONN IC DIP SOCKET 16POS GOLD |
3,617 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR20-HZL/01-TTCONN IC DIP SOCKET 20POS GOLD |
3,937 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR24-HZL/01-TTCONN IC DIP SOCKET 24POS GOLD |
2,835 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR24-HZL/7/01-TTCONN IC DIP SOCKET 24POS GOLD |
2,365 | 0.00 |
RFQ |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | |
|
AR48-HZL/01-TTCONN IC DIP SOCKET 48POS GOLD |
3,318 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
|
AR06-HZL/07-TTCONN IC DIP SOCKET 6POS GOLD |
3,497 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR08-HZL/07-TTCONN IC DIP SOCKET 8POS GOLD |
3,529 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR14-HZL/07-TTCONN IC DIP SOCKET 14POS GOLD |
3,156 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR16-HZL/07-TTCONN IC DIP SOCKET 16POS GOLD |
3,191 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR18-HZL/07-TTCONN IC DIP SOCKET 18POS GOLD |
2,489 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
AR20-HZL/07-TTCONN IC DIP SOCKET 20POS GOLD |
2,870 | 0.00 |
RFQ |
Datasheet |
Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
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