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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-822114-4CONN SOCKET PQFP 160POS TIN-LEAD |
2,030 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | QFP | 160 (4 x 40) | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
A24-LC-7RCONN IC DIP SOCKET 24POS TIN |
2,250 | 0.00 |
RFQ |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | - | Through Hole | Open Frame | - | - | - | - | - | - | |
|
1-1825093-4CONN IC DIP SOCKET 16POS GOLD |
3,159 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
5-5916783-2CONN SOCKET PGA ZIF 370POS GOLD |
3,047 | 0.00 |
RFQ |
Tray | - | Obsolete | PGA, ZIF (ZIP) | 370 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Liquid Crystal Polymer (LCP) | |
|
1-1825108-2CONN IC DIP SOCKET 28POS GOLD |
3,756 | 0.00 |
RFQ |
Tube | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | |
|
5916716-1CONN SOCKET PGA ZIF 321POS GOLD |
3,639 | 0.00 |
RFQ |
Datasheet |
Tray | - | Obsolete | PGA, ZIF (ZIP) | 321 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
1-390261-2CONN IC DIP SOCKET 8POS TIN |
2,925 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - |
|
1-390261-3CONN IC DIP SOCKET 14POS TIN |
3,711 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - |
|
1-390261-4CONN IC DIP SOCKET 16POS TIN |
3,778 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - |
|
1-390262-2CONN IC DIP SOCKET 28POS TIN |
3,757 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole, Right Angle, Vertical | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | - |
|
|
2-641266-1CONN IC DIP SOCKET 24POS TIN |
3,450 | 0.00 |
RFQ |
Datasheet |
Box | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic |
|
290-1294-00-3302JCONN IC DIP SOCKET ZIF 90POS GLD |
3,981 | 0.00 |
RFQ |
Datasheet |
Bulk | Textool™ | Active | DIP, ZIF (ZIP) | 90 (2 x 45) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
218-7223-55-1902CONN SOCKET SOIC 18POS GOLD |
3,553 | 0.00 |
RFQ |
Datasheet |
Bulk | Textool™ | Active | SOIC | 18 (2 x 9) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
1-390261-8CONN IC DIP SOCKET 24POS TIN |
3,822 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | - |
|
|
390263-5CONN IC DIP SOCKET 42POS TINLEAD |
2,452 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | - |
|
|
2-643649-3CONN SOCKET SIP 17POS TIN |
2,795 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | SIP | 17 (1 x 17) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
1-1437537-9CONN IC DIP SOCKET 8POS GOLD |
2,618 | 0.00 |
RFQ |
Datasheet |
- | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | - |
|
|
6-1437539-2CONN IC DIP SOCKET 22POS GOLD |
2,707 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
2-1437542-7CONN IC DIP SOCKET 20POS GOLD |
3,678 | 0.00 |
RFQ |
Datasheet |
- | 700 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy |
|
2-1437531-2CONN IC DIP SOCKET 14POS GOLD |
2,269 | 3.16 |
RFQ |
Bulk,Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | - |
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