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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
832-AG11D-ESL-LFCONN IC DIP SOCKET 32POS GOLD |
3,115 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
347846-3CONN IC DIP SOCKET 28POS TINLEAD |
2,276 | 0.00 |
RFQ |
- | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin-Lead | - | - | Through Hole, Right Angle, Horizontal | Open Frame | - | - | - | - | - | - | |
|
|
390263-7CONN IC DIP SOCKET 24POS TINLEAD |
2,034 | 0.00 |
RFQ |
Datasheet |
Box | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | - |
|
|
4-1437504-5CONN TRANSIST TO-3 3POS GOLD |
3,342 | 0.00 |
RFQ |
Datasheet |
Bulk | 8060 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
8080-1G39CONN TRANSIST TO-3 3POS GOLD |
2,607 | 0.00 |
RFQ |
Datasheet |
Bulk | 8060 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Gold | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
4-1437530-6CONN SOCKET SIP 2POS GOLD |
3,009 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic |
|
|
4-1437532-3CONN IC DIP SOCKET 28POS |
3,225 | 0.00 |
RFQ |
- | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | - | - | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | - | - | - | - | |
|
|
4-1437532-5CONN IC DIP SOCKET 28POS |
3,098 | 0.00 |
RFQ |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | - | - | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | - | - | - | - | |
|
|
4-1437532-7CONN IC DIP SOCKET 28POS |
3,814 | 0.00 |
RFQ |
- | 500 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | - | - | - | Through Hole | Closed Frame | - | 0.100 (2.54mm) | - | - | - | - | |
|
|
524-AG11D-ESLCONN IC DIP SOCKET 24POS GOLD |
3,775 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
|
4-1437538-4CONN IC DIP SOCKET 48POS TINLEAD |
3,432 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
4-1437538-8CONN IC DIP SOCKET 64POS GOLD |
3,838 | 9.38 |
RFQ |
Datasheet |
Tube,Tube | 800 | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
4-1437539-6CONN IC DIP SOCKET 18POS TINLEAD |
2,894 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
4-1437539-8CONN IC DIP SOCKET 18POS GOLD |
2,954 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
|
4-1437542-5CONN IC DIP SOCKET 24POS GOLD |
2,088 | 0.00 |
RFQ |
Datasheet |
- | 700 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Aluminum Alloy |
|
4-382568-0CONN IC DIP SOCKET 40POS TIN |
3,579 | 0.00 |
RFQ |
Datasheet |
Box | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
5-1437504-2CONN TRANSIST TO-3 3POS TIN-LEAD |
3,631 | 0.00 |
RFQ |
Datasheet |
Bulk | 8060 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
5-1437504-6CONN TRANSIST TO-3 3POS |
3,418 | 0.00 |
RFQ |
Bulk | 8060 | Obsolete | Transistor, TO-3 | 3 (Oval) | - | - | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | - | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | |
|
|
5-1437530-0CONN SOCKET SIP 6POS |
2,198 | 0.00 |
RFQ |
Datasheet |
Bulk | 500 | Obsolete | SIP | 6 (1 x 6) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | Beryllium Copper | Thermoplastic |
|
|
5-1437530-1CONN SOCKET SIP 7POS |
2,733 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | SIP | 7 (1 x 7) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | Beryllium Copper | Thermoplastic |
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