+86 13640908945+86 13640908945 sales@chipscomponents.comsales@chipscomponents.com

Welcome to Zhuoliou industry co.,ltd

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
SIP1X16-041BLF

SIP1X16-041BLF

CONN SOCKET SIP 16POS GOLD

Amphenol ICC (FCI)

3,937 0.00
- +

RFQ

SIP1X16-041BLF

Datasheet

Bulk SIP1x Obsolete SIP 16 (1 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
DPF316-998Z

DPF316-998Z

CONN IC DIP SOCKET 16POS TINLEAD

Amphenol ICC (FCI)

2,766 0.00
- +

RFQ

DPF316-998Z

Datasheet

Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF314-998Z

DPF314-998Z

CONN IC DIP SOCKET 14POS TINLEAD

Amphenol ICC (FCI)

2,020 0.00
- +

RFQ

DPF314-998Z

Datasheet

Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DPF308-998Z

DPF308-998Z

CONN IC DIP SOCKET 8POS TIN-LEAD

Amphenol ICC (FCI)

3,799 0.00
- +

RFQ

DPF308-998Z

Datasheet

Bag DPF3 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
SIP1X02-041BLF

SIP1X02-041BLF

CONN SOCKET SIP 2POS GOLD

Amphenol ICC (FCI)

2,938 0.00
- +

RFQ

SIP1X02-041BLF

Datasheet

Bulk SIP1x Obsolete SIP 2 (1 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
1-1747890-1

1-1747890-1

CONN SOCKET LGA 771POS GOLD

TE Connectivity AMP Connectors

3,291 0.00
- +

RFQ

1-1747890-1

Datasheet

Tray - Obsolete LGA 771 (33 x 33) 0.043 (1.09mm) Gold - Copper Alloy Surface Mount Open Frame Solder 0.043 (1.09mm) - - - Thermoplastic
1735315-4

1735315-4

CONN SOCKET PGA ZIF 939POS GOLD

TE Connectivity AMP Connectors

3,642 0.00
- +

RFQ

1735315-4

Datasheet

Tray - Obsolete PGA, ZIF (ZIP) 939 (31 x 31) 0.050 (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1871554-1

1871554-1

CONN SKT 1207-F RIGHT LEVER SMD

TE Connectivity AMP Connectors

2,621 39.54
- +

RFQ

1871554-1

Datasheet

Bulk - Obsolete LGA 1207 (33 x 34) 0.043 (1.09mm) Gold - Copper Alloy Surface Mount Closed Frame Solder 0.043 (1.09mm) Gold - Copper Alloy Thermoplastic
1761503-1

1761503-1

CONN SOCKET PGA 940POS GOLD

TE Connectivity AMP Connectors

2,337 0.00
- +

RFQ

1761503-1

Datasheet

Tray - Active PGA 940 (30 x 30) 0.050 (1.27mm) Gold 30.0µin (0.76µm) - Surface Mount Closed Frame - - - - - -
1-1903401-4

1-1903401-4

CONN SOCKET PGA 638POS GOLD

TE Connectivity AMP Connectors

2,759 0.00
- +

RFQ

1-1903401-4

Datasheet

Tape & Reel (TR),Cut Tape (CT) - Obsolete PGA 638 (26 x 26) 0.050 (1.27mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.050 (1.27mm) Gold - Copper Alloy Thermoplastic
1674770-6

1674770-6

CONN SOCKET PGA ZIF 479POS GOLD

TE Connectivity AMP Connectors

2,783 0.00
- +

RFQ

1674770-6

Datasheet

Tape & Reel (TR),Cut Tape (CT) - Obsolete PGA, ZIF (ZIP) 479 (26 x 26) 0.050 (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050 (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
8180-E1

8180-E1

CONN TRANSIST TO-3 4POS TIN

Aavid, Thermal Division of Boyd Corporation

3,640 0.00
- +

RFQ

8180-E1

Datasheet

Bulk 8180 Active Transistor, TO-3 4 (Oval) - Tin - Steel Through Hole Closed Frame Solder - Tin - Steel Polyamide (PA), Nylon, Glass Filled
A28-LC-7-TT-R

A28-LC-7-TT-R

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

3,849 0.00
- +

RFQ

A28-LC-7-TT-R

Datasheet

Box - Obsolete DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT)
MHAS-181-ZMGG-15

MHAS-181-ZMGG-15

CONN SOCKET BGA 181POS GOLD

Samtec Inc.

2,327 0.00
- +

RFQ

MHAS-181-ZMGG-15

Datasheet

Bulk MHA Obsolete BGA 181 (15 x 15) 0.100 (2.54mm) Gold - - Through Hole Open Frame Solder 0.100 (2.54mm) Gold - - -
100-006-050

100-006-050

CONN IC DIP SOCKET 6POS GOLD

3M

2,086 0.00
- +

RFQ

100-006-050

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-008-050

100-008-050

CONN IC DIP SOCKET 8POS GOLD

3M

3,451 0.00
- +

RFQ

100-008-050

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-008-051

100-008-051

CONN IC DIP SOCKET 8POS GOLD

3M

2,994 0.00
- +

RFQ

100-008-051

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-010-050

100-010-050

CONN IC DIP SOCKET 10POS GOLD

3M

2,619 0.00
- +

RFQ

100-010-050

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-014-050

100-014-050

CONN IC DIP SOCKET 14POS GOLD

3M

2,112 0.00
- +

RFQ

100-014-050

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-014-051

100-014-051

CONN IC DIP SOCKET 14POS GOLD

3M

2,703 0.00
- +

RFQ

100-014-051

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Records«Prev1... 773774775776777778779780...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Help you to save your cost and time.
    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
    Copyright © 2023 Zhuoliou industry co.,ltd
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER