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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
3-1825046-0CONN IC DIP SOCKET 32POS GOLD |
3,135 | 0.00 |
RFQ |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - | |
|
|
3-1825046-2CONN IC DIP SOCKET 40POS GOLD |
2,288 | 0.00 |
RFQ |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - | |
|
|
1825056-1CONN IC DIP SOCKET 14POS TIN |
2,033 | 0.00 |
RFQ |
Tube | 500 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Copper | - | |
|
|
1825088-6CONN IC DIP SOCKET 20POS GOLD |
3,303 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Thermoplastic |
|
|
1-1825094-6CONN IC DIP SOCKET 20POS GOLD |
2,417 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
1-1825108-1CONN IC DIP SOCKET 24POS GOLD |
2,176 | 0.00 |
RFQ |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | |
|
1-1825108-3CONN IC DIP SOCKET 40POS GOLD |
3,630 | 0.00 |
RFQ |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | |
|
|
1825109-1CONN IC DIP SOCKET 24POS GOLD |
3,619 | 0.00 |
RFQ |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | |
|
|
3-1825276-2CONN IC DIP SOCKET 32POS GOLD |
3,205 | 0.00 |
RFQ |
Datasheet |
Tray | Diplomate DL | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled |
|
|
1825373-6CONN IC DIP SOCKET 20POS GOLD |
3,168 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
1825374-6CONN IC DIP SOCKET 20POS GOLD |
2,224 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
1825412-1CONN IC DIP SOCKET 8POS GOLD |
3,617 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Brass | Thermoplastic, Polyester |
|
|
520-AG12D-LFCONN IC DIP SOCKET 20POS TIN |
3,415 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
382441-3CONN SOCKET SIP 7POS TIN |
2,221 | 0.00 |
RFQ |
Datasheet |
Tray | Diplomate DL | Obsolete | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
643640-8CONN SOCKET SIP 8POS TIN |
2,859 | 0.00 |
RFQ |
Datasheet |
Tray | Diplomate DL | Obsolete | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
643644-6CONN SOCKET SIP 12POS TIN |
3,634 | 0.00 |
RFQ |
Datasheet |
Tray | Diplomate DL | Obsolete | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled |
|
643645-3CONN SOCKET SIP 13POS TIN |
3,592 | 0.00 |
RFQ |
Datasheet |
Tray | Diplomate DL | Obsolete | SIP | 13 (1 x 13) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
643649-8CONN SOCKET SIP 17POS TIN |
3,061 | 0.00 |
RFQ |
Datasheet |
Tray | Diplomate DL | Obsolete | SIP | 17 (1 x 17) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-822064-5CONN SOCKET PQFP 132POS TIN-LEAD |
2,525 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | QFP | 132 (4 x 33) | 0.025 (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.025 (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
2-1571995-0CONN SOCKET SIP 20POS TIN |
3,444 | 0.00 |
RFQ |
Datasheet |
Tube | 510 | Obsolete | SIP | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester |
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