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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMPX-32LCC-NSMT PLCC SOCKET 32P NON POLARISE |
3,832 | 1.04 |
RFQ |
Datasheet |
Tube | SMPX | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
SMPX-28LCC-PSMT PLCC SOCKET 28P POLARISED RO |
2,809 | 1.04 |
RFQ |
Datasheet |
Tube | SMPX | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
SMPX-32LCC-PSMT PLCC SOCKET 32P POLARISED RO |
2,546 | 1.04 |
RFQ |
Datasheet |
Tube | SMPX | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
8420-21B1-RK-TRCONN SOCKET PLCC 20POS TIN |
2,304 | 1.04 |
RFQ |
Datasheet |
Tape & Reel (TR) | 8400 | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
612-83-314-41-001101CONN IC DIP SOCKET 14POS GOLD |
3,884 | 0.98 |
RFQ |
Datasheet |
Bulk | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-83-318-41-001101CONN IC DIP SOCKET 18POS GOLD |
2,506 | 1.02 |
RFQ |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
115-87-324-41-003101CONN IC DIP SOCKET 24POS GOLD |
2,880 | 0.98 |
RFQ |
Datasheet |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-87-424-41-003101CONN IC DIP SOCKET 24POS GOLD |
2,880 | 0.98 |
RFQ |
Datasheet |
Bulk | 115 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-037-10-061101CONN SOCKET PGA 37POS GOLD |
3,759 | 1.12 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 37 (10 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
SMPX-52LCC-N-TRSMT PLCC 52P NON POLARISED, T&R |
2,156 | 1.05 |
RFQ |
Datasheet |
Tape & Reel (TR) | SMPX | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
|
ED084PLCZCONN SOCKET PLCC 84POS TIN |
3,502 | 1.05 |
RFQ |
Datasheet |
Tube | ED | Active | PLCC | 84 (2x42) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) |
|
|
06-3513-10TCONN IC DIP SOCKET 6POS GOLD |
3,045 | 1.06 |
RFQ |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
110-83-318-41-005101CONN IC DIP SOCKET 18POS GOLD |
2,717 | 1.00 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-83-318-41-605101CONN IC DIP SOCKET 18POS GOLD |
2,448 | 1.00 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
2,092 | 1.00 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-83-320-41-001151CONN IC DIP SOCKET 20POS GOLD |
3,116 | 1.00 |
RFQ |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
110-83-420-41-001101CONN IC DIP SOCKET 20POS GOLD |
3,302 | 1.00 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
AR 18-HZW/TNCONN IC DIP SOCKET 18POS GOLD |
3,164 | 1.07 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |
|
114-87-624-41-117101CONN IC DIP SOCKET 24POS GOLD |
3,912 | 1.00 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
114-87-624-41-134161CONN IC DIP SOCKET 24POS GOLD |
2,069 | 1.00 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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