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Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
AR 14-HZL-TT CONN IC DIP SOCKET 14POS TIN Assmann WSW Components	7,998	0.80	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
115-47-308-41-001000 CONN IC DIP SOCKET 8POS GOLD Mill-Max Manufacturing Corp.	855	0.80	- + RFQ	Datasheet	Tube	115	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-87-308-41-105191 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	4,197	1.25	- + RFQ		Tape & Reel (TR),Cut Tape (CT)	110	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-308-41-117101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	16,091	0.71	- + RFQ	Datasheet	Tube	114	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-308-41-134161 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	8,466	0.71	- + RFQ	Datasheet	Tube	114	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
PLCC-32-AT-SMT PLCC SOCKET 32P SMT Adam Tech	2,589	0.83	- + RFQ	Datasheet	Tube	PLCC	Active	PLCC	32 (2 x 7, 2 x 9)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled
AR 14-HZL/01-TT CONN IC DIP SOCKET 14POS GOLD Assmann WSW Components	15,472	0.85	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
DILB24P-223TLF CONN IC DIP SOCKET 24POS TINLEAD Amphenol ICC (FCI)	562	0.85	- + RFQ	Datasheet	Tube	DILB	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon
SA163040 CONN IC DIP SOCKET 16POS GOLD On Shore Technology Inc.	357	0.85	- + RFQ	Datasheet	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	80.0µin (2.03µm)	Brass	Thermoplastic, Polyester, Glass Filled
SA183000 CONN IC DIP SOCKET 18POS GOLD On Shore Technology Inc.	1,467	0.85	- + RFQ	Datasheet	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled
1-2199298-9 CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	7,232	0.88	- + RFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.3 (7.62mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled
1-2199299-2 28P,DIP SKT,600 CL,LDR,PB FREE TE Connectivity AMP Connectors	7,003	0.88	- + RFQ	Datasheet	Tube	Diplomate DL	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	60.0µin (1.52µm)	Nickel	Polybutylene Terephthalate (PBT), Glass Filled
08-3518-10 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	3,837	0.88	- + RFQ	Datasheet	Bulk	518	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
PLCC-44-AT-SMT PLCC SOCKET 44P SMT Adam Tech	3,219	0.88	- + RFQ	Datasheet	Tube	PLCC	Active	PLCC	44 (4 x 11)	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050 (1.27mm)	Tin	80.0µin (2.03µm)	Phosphor Bronze	Thermoplastic
4824-3000-CP CONN IC DIP SOCKET 24POS TIN 3M	8,895	0.89	- + RFQ	Datasheet	Tube	4800	Active	DIP, 0.3 (7.62mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
4824-6000-CP CONN IC DIP SOCKET 24POS TIN 3M	1,799	0.89	- + RFQ	Datasheet	Tube	4800	Active	DIP, 0.6 (15.24mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled
AR 16-HZL-TT CONN IC DIP SOCKET 16POS TIN Assmann WSW Components	4,603	0.91	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.3 (7.62mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Thermoplastic, Polyester
SA203000 CONN IC DIP SOCKET 20POS GOLD On Shore Technology Inc.	4,221	0.94	- + RFQ	Datasheet	Tube	SA	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled
DILB28P-223TLF CONN IC DIP SOCKET 28POS TIN Amphenol ICC (FCI)	6,354	0.96	- + RFQ	Datasheet	Tube	-	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon
4828-6000-CP CONN IC DIP SOCKET 28POS TIN 3M	5,127	0.98	- + RFQ	Datasheet	Tube	4800	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled