+86 13640908945+86 13640908945 sales@chipscomponents.comsales@chipscomponents.com

Welcome to Zhuoliou industry co.,ltd

Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-652-61-008000

116-93-652-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,777 28.11
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-13-964-61-001000

110-13-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,604 28.16
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
32-6570-11

32-6570-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

3,686 28.20
- +

RFQ

32-6570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3503-31

36-3503-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,619 28.85
- +

RFQ

36-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-360M19-001166

550-10-360M19-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

2,037 27.73
- +

RFQ

550-10-360M19-001166

Datasheet

Bulk 550 Active BGA 360 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-352M26-001166

550-10-352M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

2,327 27.93
- +

RFQ

550-10-352M26-001166

Datasheet

Bulk 550 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-93-108-12-051002

510-93-108-12-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,523 29.11
- +

RFQ

510-93-108-12-051002

Datasheet

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
36-6551-11

36-6551-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,635 26.25
- +

RFQ

36-6551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6552-11

36-6552-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,606 26.25
- +

RFQ

36-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6553-11

36-6553-11

CONN IC DIP SOCKET ZIF 36POS

Aries Electronics

3,123 26.25
- +

RFQ

36-6553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3552-11

36-3552-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

3,799 26.25
- +

RFQ

36-3552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3554-11

36-3554-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

3,625 26.25
- +

RFQ

36-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6554-11

36-6554-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,728 26.25
- +

RFQ

36-6554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
116-43-652-61-006000

116-43-652-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,764 26.29
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-652-61-006000

116-93-652-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,638 26.29
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
517-83-411-20-111111

517-83-411-20-111111

CONN SOCKET PGA 411POS GOLD

Preci-Dip

3,895 24.59
- +

RFQ

517-83-411-20-111111

Datasheet

Bulk 517 Active PGA 411 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6556-21

32-6556-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,563 26.35
- +

RFQ

32-6556-21

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
32-6556-31

32-6556-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,130 26.35
- +

RFQ

32-6556-31

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
123-13-952-41-001000

123-13-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,962 26.38
- +

RFQ

123-13-952-41-001000

Datasheet

Tube 123 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
36-0508-21

36-0508-21

CONN SOCKET SIP 36POS GOLD

Aries Electronics

2,419 26.40
- +

RFQ

36-0508-21

Datasheet

Bulk 508 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
Total 21991 Records«Prev1... 631632633634635636637638...1100Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Help you to save your cost and time.
    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
    Copyright © 2023 Zhuoliou industry co.,ltd
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER