Sockets for ICs, Transistors - Zhuoliou industry co.,ltd

+86 13640908945

sales@chipscomponents.com

Welcome to Zhuoliou industry co.,ltd

Cart

All Product

More product categories >>

Mfr. Part #	Availability	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
510-91-098-13-061003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,158	25.91	- + RFQ	Datasheet	Bulk	510	Active	PGA	98 (13 x 13)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-656-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,462	25.91	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
117-93-656-61-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,838	25.91	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
123-13-950-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp.	2,801	25.92	- + RFQ	Datasheet	Tube	123	Active	DIP, 0.9 (22.86mm) Row Spacing	50 (2 x 25)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-13-628-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,495	25.94	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-43-650-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,070	25.98	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
116-93-650-61-006000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,866	25.98	- + RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
60-9503-20 CONN IC DIP SOCKET 60POS GOLD Aries Electronics	2,117	26.01	- + RFQ	Datasheet	Bulk	503	Active	DIP, 0.9 (22.86mm) Row Spacing	60 (2 x 30)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
60-9503-30 CONN IC DIP SOCKET 60POS GOLD Aries Electronics	3,990	26.01	- + RFQ	Datasheet	Bulk	503	Active	DIP, 0.9 (22.86mm) Row Spacing	60 (2 x 30)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
322-13-164-41-001000 SOCKET 2 LEVEL WRAPOST SIP 64POS Mill-Max Manufacturing Corp.	3,600	26.02	- + RFQ	Datasheet	Tube	322	Active	SIP	64 (1 x 64)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-C182-21 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	2,029	26.03	- + RFQ	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-31 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3,345	26.03	- + RFQ	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-21 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	2,636	26.03	- + RFQ	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C212-31 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3,148	26.03	- + RFQ	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-21 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3,829	26.03	- + RFQ	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-C300-31 CONN IC DIP SOCKET 28POS GOLD Aries Electronics	3,702	26.03	- + RFQ	Datasheet	Bulk	EJECT-A-DIP™	Active	DIP, 0.6 (15.24mm) Row Spacing	28 (2 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
510-41-100-13-062001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,025	26.06	- + RFQ	Datasheet	Bulk	510	Active	PGA	100 (13 x 13)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-100-10-000001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	2,016	26.06	- + RFQ	Datasheet	Bulk	510	Active	PGA	100 (10 x 10)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-100-13-061001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp.	3,007	26.06	- + RFQ	Datasheet	Bulk	510	Active	PGA	100 (13 x 13)	0.100 (2.54mm)	-	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-100-10-000001 SOCKET SOLDERTAIL 100-PGA Mill-Max Manufacturing Corp.	2,987	26.06	- + RFQ		Tube	510	Active	PGA	100 (10 x 10)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	-	-	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester