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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-144-13-041002

510-91-144-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,313 29.29
- +

RFQ

510-91-144-13-041002

Datasheet

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-144-13-041003

510-91-144-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,661 29.29
- +

RFQ

510-91-144-13-041003

Datasheet

Bulk 510 Active PGA 144 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-144-15-082002

510-91-144-15-082002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,365 29.29
- +

RFQ

510-91-144-15-082002

Datasheet

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-144-15-082003

510-91-144-15-082003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,843 29.29
- +

RFQ

510-91-144-15-082003

Datasheet

Bulk 510 Active PGA 144 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-065-10-051001

510-13-065-10-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,121 29.29
- +

RFQ

510-13-065-10-051001

Datasheet

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-065-10-051002

510-13-065-10-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,077 29.29
- +

RFQ

510-13-065-10-051002

Datasheet

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-065-10-051003

510-13-065-10-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,021 29.29
- +

RFQ

510-13-065-10-051003

Datasheet

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-648-G-C

APA-648-G-C

ADAPTER PLUG

Samtec Inc.

2,876 29.33
- +

RFQ

Bulk APA Active - 48 (2 x 24) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
39-0511-11

39-0511-11

CONN SOCKET SIP 39POS GOLD

Aries Electronics

3,314 29.34
- +

RFQ

39-0511-11

Datasheet

Bulk 511 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-1508-21

40-1508-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,941 29.34
- +

RFQ

40-1508-21

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
40-1508-31

40-1508-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,766 29.34
- +

RFQ

40-1508-31

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
32-C182-21

32-C182-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,007 29.34
- +

RFQ

32-C182-21

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C182-31

32-C182-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,737 29.34
- +

RFQ

32-C182-31

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-21

32-C212-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,664 29.34
- +

RFQ

32-C212-21

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-31

32-C212-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,110 29.34
- +

RFQ

32-C212-31

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-21

32-C300-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,556 29.34
- +

RFQ

32-C300-21

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C300-31

32-C300-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,449 29.34
- +

RFQ

32-C300-31

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-91-145-15-081001

510-91-145-15-081001

SOCKET SOLDERTAIL 145-PGA

Mill-Max Manufacturing Corp.

3,579 29.37
- +

RFQ

Tube 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-15-081002

510-91-145-15-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,546 29.37
- +

RFQ

510-91-145-15-081002

Datasheet

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-15-081003

510-91-145-15-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,994 29.37
- +

RFQ

510-91-145-15-081003

Datasheet

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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