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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-145-13-041001

510-91-145-13-041001

SOCKET SOLDERTAIL 145-PGA

Mill-Max Manufacturing Corp.

2,331 29.37
- +

RFQ

Bulk 510 Active PGA 145 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-15-002001

510-91-145-15-002001

SOCKET SOLDERTAIL 145-PGA

Mill-Max Manufacturing Corp.

2,674 29.37
- +

RFQ

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-17-001001

510-91-145-17-001001

SOCKET SOLDERTAIL 145-PGA

Mill-Max Manufacturing Corp.

2,376 29.37
- +

RFQ

Bulk 510 Active PGA 145 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-145-15-002001

510-41-145-15-002001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,859 29.37
- +

RFQ

510-41-145-15-002001

Datasheet

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-145-15-081001

510-41-145-15-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,168 29.37
- +

RFQ

510-41-145-15-081001

Datasheet

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-13-041002

510-91-145-13-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,263 29.37
- +

RFQ

510-91-145-13-041002

Datasheet

Bulk 510 Active PGA 145 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-13-041003

510-91-145-13-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,808 29.37
- +

RFQ

510-91-145-13-041003

Datasheet

Bulk 510 Active PGA 145 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-15-002002

510-91-145-15-002002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,255 29.37
- +

RFQ

510-91-145-15-002002

Datasheet

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-15-002003

510-91-145-15-002003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,848 29.37
- +

RFQ

510-91-145-15-002003

Datasheet

Bulk 510 Active PGA 145 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-17-001002

510-91-145-17-001002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,476 29.37
- +

RFQ

510-91-145-17-001002

Datasheet

Bulk 510 Active PGA 145 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-145-17-001003

510-91-145-17-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,835 29.37
- +

RFQ

510-91-145-17-001003

Datasheet

Bulk 510 Active PGA 145 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-356M26-001166

550-10-356M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

3,749 28.25
- +

RFQ

550-10-356M26-001166

Datasheet

Bulk 550 Active BGA 356 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
116-43-964-61-003000

116-43-964-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,239 29.38
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-964-61-003000

116-93-964-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,946 29.38
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
550-10-255M16-001152

550-10-255M16-001152

BGA SOLDER TAIL

Preci-Dip

3,016 27.56
- +

RFQ

550-10-255M16-001152

Datasheet

Bulk 550 Active BGA 255 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
32-6508-211

32-6508-211

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,241 29.39
- +

RFQ

32-6508-211

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-311

32-6508-311

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,157 29.39
- +

RFQ

32-6508-311

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-6556-31

36-6556-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,063 29.41
- +

RFQ

36-6556-31

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
36-6556-21

36-6556-21

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,843 29.41
- +

RFQ

36-6556-21

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
510-93-049-07-000001

510-93-049-07-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,435 29.44
- +

RFQ

510-93-049-07-000001

Datasheet

Tube 510 Active DIP, 0.1 (2.54mm) Row Spacing 49 (7 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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