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| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Package/Case | Packaging | Series | ProductStatus | Architecture | CoreProcessor | FlashSize | RAMSize | Peripherals | Connectivity | Speed | PrimaryAttributes | OperatingTemperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
M2S050-FGG896IC SOC CORTEX-M3 166MHZ 896FBGA |
3,504 | 144.49 |
RFQ |
Datasheet |
896-BGA | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | 0°C ~ 85°C (TJ) |
|
M2S050T-FGG484IIC SOC CORTEX-M3 166MHZ 484FBGA |
3,586 | 160.77 |
RFQ |
Datasheet |
484-BGA | Tray | SmartFusion®2 | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 50K Logic Modules | -40°C ~ 100°C (TJ) |
|
XC7Z015-2CLG485EIC SOC CORTEX-A9 766MHZ 485CSBGA |
3,418 | 173.43 |
RFQ |
Datasheet |
485-LFBGA, CSPBGA | Tray | Zynq®-7000 | Active | MCU, FPGA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 766MHz | Artix™-7 FPGA, 74K Logic Cells | 0°C ~ 100°C (TJ) |
|
PXB4330EV1.1AOP ATM OAM PROCESSOR |
2,330 | 1.00 |
RFQ |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
|
|
R8J66607B00FP#RF1SSOC/SIP |
3,395 | 1.00 |
RFQ |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
|
|
UPD720231AK8-612-BAESOC, USB 3.0/2.0 CONTROLLER |
3,986 | 1.00 |
RFQ |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
|
|
UPD63711AGC-8EU-ASOC ANALOG CD/TUNER |
3,747 | 0.00 |
RFQ |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
|
|
QN9083CUK,019QN908X: ULTRA-LOW-POWER BLUETOOT |
2,776 | 1.00 |
RFQ |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
|
PSB21473FV1.3INCA-D PBX PHONE SOC |
2,640 | 1.00 |
RFQ |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
|
|
TLE92672QXXUMA2TLE9267 - SYSTEM BASIS CHIP |
2,873 | 1.00 |
RFQ |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
|
|
NHE6300ESBMULTIFUNCTION PERIPHERAL, CMOS |
2,443 | 0.00 |
RFQ |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | ||
|
|
TLE92682QXXUMA2TLE9268-2QX - SYSTEM BASIS CHIP |
3,597 | 1.00 |
RFQ |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - | |
|
UPD72874AGC-YEB-ASOC / AV LINK |
3,859 | 12.06 |
RFQ |
Datasheet |
- | Bulk | * | Active | - | - | - | - | - | - | - | - | - |
|
PLCHIP-P13-51220P13 PLC ON A CHIP LQFP-208, UP T |
2,655 | 52.05 |
RFQ |
Datasheet |
208-LQFP | Tray | - | Active | MCU | PLC | 256KB | 32KB | LCD, PWM, WDT | CANbus, Ethernet, I²C, MMC/SD, SPI, UART/USART | 12MHz | - | -40°C ~ 85°C (TJ) |
|
XC7Z007S-1CLG225IIC SOC CORTEX-A9 667MHZ 225BGA |
2,487 | 55.90 |
RFQ |
Datasheet |
225-LFBGA, CSPBGA | Tray | Zynq®-7000 | Active | MCU, FPGA | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | 256KB | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 667MHz | Artix™-7 FPGA, 23K Logic Cells | -40°C ~ 100°C (TJ) |
|
|
M2S025T-FCSG158IM2S025T-FCSG158I |
2,466 | 78.40 |
RFQ |
158-BGA, FCBGA | Tray | - | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | -40°C ~ 100°C (TJ) | |
|
|
M2S025T-1FCSG158IM2S025T-1FCSG158I |
2,871 | 84.41 |
RFQ |
158-BGA, FCBGA | Tray | - | Active | MCU, FPGA | ARM® Cortex®-M3 | 256KB | 64KB | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 166MHz | FPGA - 25K Logic Modules | -40°C ~ 100°C (TJ) | |
|
DRA829JMTGBALFRDUAL ARM CORTEX-A72, QUAD CORTEX |
2,957 | 100.96 |
RFQ |
827-BFBGA, FCBGA | Tape & Reel (TR),Cut Tape (CT) | - | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | |
|
|
TDA4VM88TGBALFRNEXT GENERATION SOC FAMILY FOR L |
2,172 | 118.00 |
RFQ |
827-BFBGA, FCBGA | Tape & Reel (TR),Cut Tape (CT) | Automotive, AEC-Q100 | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SDSD/IOI²C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 105°C (TJ) | |
|
|
TDA4VM88TGBALFRQ1NEXT GENERATION SOC FAMILY FOR L |
3,988 | 123.89 |
RFQ |
827-BFBGA, FCBGA | Tape & Reel (TR),Cut Tape (CT) | Automotive, AEC-Q100 | Active | DSP, MCU, MPU | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | - | 1.5MB | DMA, PWM, WDT | MCAN, MMC/SDSD/IOI²C, SPI, UART, USB | 2GHz, 1GHz, 1.35GHz, 1GHz | - | -40°C ~ 125°C (TJ) |
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